Semiconductor Advanced PackagingPublisher: Springer Nature Year: 17/05/2021 ISBN: 9789811613760 Publication form: eBook: Reflowable eTextbook (ePub)
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707.52 PLN
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Basics Fashion Design 09: Designing AccessoriesPublisher: Bloomsbury UK Year: 11/01/2021 Edition: First ISBN: 9781350241442 Publication form: eBook: Reflowable eTextbook (ePub)
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172.49 PLN
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Assembly and Reliability of Lead-Free Solder JointsPublisher: Springer Nature Year: 29/05/2020 ISBN: 9789811539206 Publication form: eBook: Reflowable eTextbook (ePub)
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Heterogeneous IntegrationsPublisher: Springer Nature Year: 03/04/2019 ISBN: 9789811372247 Publication form: eBook: Reflowable eTextbook (ePub)
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817.21 PLN
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Fan-Out Wafer-Level PackagingPublisher: Springer Nature Year: 05/04/2018 ISBN: 9789811088841 Publication form: eBook: Reflowable eTextbook (ePub)
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542.97 PLN
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3D IC Integration and PackagingPublisher: McGraw-Hill Professional Year: 06/07/2015 Edition: First ISBN: 9780071848077 Publication form: eBook: Reflowable eTextbook (ePub)
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888.51 PLN
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Strategies for a Successful Retirement: Before, During, & AfterPublisher: Ebookit.com Year: 21/02/2013 ISBN: 9781456608125 Publication form: eBook: Reflowable eTextbook (ePub)
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27.43 PLN
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Basics Fashion Design 09: Designing AccessoriesPublisher: Bloomsbury UK Year: 08/10/2012 Edition: First ISBN: 9782940439720 Publication form: eBook: Fixed Page eTextbook (PDF)
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172.49 PLN
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Through-Silicon Vias for 3D IntegrationPublisher: McGraw-Hill Professional Year: 05/08/2012 Edition: First ISBN: 9780071785150 Publication form: eBook: Reflowable eTextbook (ePub)
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799.66 PLN
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Reliability of RoHS-Compliant 2D and 3D IC InterconnectsPublisher: McGraw-Hill Professional Year: 22/10/2010 Edition: First ISBN: 9780071753807 Publication form: eBook: Reflowable eTextbook (ePub)
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720.68 PLN
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