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ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

Authors
Publisher A S M International
Year 30/07/2022
Pages 461
Version paperback
Readership level Professional and scholarly
Language English
ISBN 9781627084192
Categories Testing of materials
$237.14 (with VAT)
1 054.20 PLN / €226.02 / £196.21
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Book description

The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.

ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

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