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Unique in focusing on both organic and inorganic materials from a system point of view, this text offers a complete overview of printed electronics integrated with classical silicon electronics.Following an introduction to the topic, the book discusses the materials and processes required for printed electronics, covering conducting, semiconducting and insulating materials, as well as various substrates, such as paper and plastics. Subsequent chapters describe the various building blocks for printed electronics, while the final part describes the resulting novel applications and technologies, including wearable electronics, RFID tags and flexible circuit boards.Suitable for a broad target group, both industrial and academic, ranging from mechanical engineers to ink developers, and from chemists to engineers.

Smart Electronic Systems: Heterogeneous Integration of Silicon and Printed Electronics

INTRODUCTIONDefinition of Printed Electronic SystemsTechnology, Applications and MarketsChallenges and Future TrendsReferencesPART 1: MATERIALS AND PROCESSES FOR PRINTED ELECTRONICS.FUNCTIONAL ELECTRONIC INKS Introduction Conductive Inks Semiconducting Inks SummaryFLEXIBLE SUBSTRATES AND FOR PRINTED INTERCONNECTIONSIntroduction Polyimide versus Paper Sheets Paper Surface Properties and Printed Interconnections Reliability Assessment of Paper Based Printed Interconnections SummaryPART 2: PRINTED ELECTRONIC BUILDING BLOCKS.PRINTED THIN FILM TRANSISTORS (TFTS) AND CIRCUITS IntroductionPrinting Process of TFTs Electrical Performance of the TFTsCarbon Nanotube TFTs and CircuitsSummary and OutlookPRINTED PASSIVE WIRELESS SENSORS IntroductionSensing MaterialsTime Domain Based SensorsFrequency Domain Based SensorsConclusion and Future WorkPRINTED RFID ANTENNAS BackgroundTrends and Challenges Narrow Band RFID AntennasWideband RFID AntennasSensor-enabled AntennasConclusions and Future WorkPRINTED CHIPLESS RFID TAGS IntroductionApplications and Market ProjectionTime Domain Chip-less RFID TagsFrequency Domain Based Chip-less RFID tagsSummary and Future WorkPART 3. SYSTEM INTEGRATION FOR PRINTED ELECTRONICS.FLEXIBLE BIO-PATCHBackground Integration MethodologyPaper-based Bio-patchPolyimide-based Bio-patchSummary and Future WorkHUMIDITY SENSOR CARDSIntroductionSystem OverviewIntegration MethodologyDemonstrations of Humidity Sensor Cards on Plastic and PaperBendability of the CardsConclusionSUMMARY AND OUTLOOK